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 a
FEATURES 460 kbps Data Rate Specified at +3.3 V Meets EIA-232E Specifications 0.1 F Charge Pump Capacitors Low Power Shutdown (ADM3222E and ADM1385) DIP, SO, SOIC, SSOP and TSSOP Package Options Upgrade for MAX3222/32 and LTC1385 APPLICATIONS General Purpose RS-232 Data Link Portable Instruments Printers Palmtop Computers PDAs
Low Power, +3.3 V, RS-232 Line Drivers/Receivers ADM3202/ADM3222/ADM1385
FUNCTIONAL BLOCK DIAGRAMS
+3.3V INPUT
0.1 F + 10V
C1+ +3.3V TO +6.6V VOLTAGE DOUBLER C1- C2+ +6.6V TO -6.6V VOLTAGE C2- INVERTER
VCC
V+ V-
C3 + 0.1 F 6.3V C4 + 0.1 F 10V
+ C5 0.1 F
0.1 F + 10V
T1IN
CMOS INPUTS
T1
T1OUT
EIA/TIA-232 OUTPUTS
T2IN R1OUT
CMOS OUTPUTS
T2
T2OUT R1IN
EIA/TIA-232 INPUTS*
R1
R2OUT
R2
R2IN
GND
ADM3202
*INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT
GENERAL DESCRIPTION
+3.3V INPUT
0.1 F + 10V
The ADM3202/ADM3222/ADM1385 transceivers are high speed, 2-channel RS-232/V.28 interface devices which operate from a single +3.3 V power supply. Low power consumption and a shutdown facility (ADM3222/ ADM1385) makes them ideal for battery powered portable instruments. The ADM3202/ADM3222/ADM1385 conforms to the EIA232E and CCITT V.28 specifications and operates at data rates up to 460 kbps. Four external 0.1 F charge pump capacitors are used for the voltage doubler/inverter permitting operation from a single +3.3 V supply. The ADM3222 contains additional enable and shutdown circuitry. The EN input may be used to three-state the receiver outputs. The SD input is used to power down the charge pump and transmitter outputs reducing the quiescent current to less than 0.5 A. The receivers remain enabled during shutdown unless disabled using EN. The ADM1385 contains a driver disable mode and a complete shutdown mode. The ADM3202 is available in a 16-lead DIP, narrow and wide SOIC as well as a space saving 20-lead TSSOP package. The ADM3222 is available in 18-lead DIP, SO and in 20-lead SSOP and TSSOP. The ADM1385 is available in a 20-lead SSOP package, which is pin compatible with the LTC1385 CG.
CMOS INPUTS CMOS INPUTS
C1+ +3.3V TO +6.6V VOLTAGE DOUBLER C1- C2+ +6.6V TO -6.6V VOLTAGE INVERTER C2-
VCC
V+ V-
C3 + 0.1 F 6.3V C4 + 0.1 F 10V
+ C5 0.1 F
0.1 F + 10V
T1IN T2IN R1OUT R2OUT EN
T1
T1OUT
EIA/TIA-232 OUTPUTS
T2
T2OUT R1IN
EIA/TIA-232 INPUTS*
R1
CMOS OUTPUTS
R2
R2IN
ADM3222
GND
SD
*INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT
+3.3V INPUT
0.1 F + 10V
C1+ +3.3V TO +6.6V VOLTAGE C1- DOUBLER C2+ +6.6V TO -6.6V VOLTAGE C2- INVERTER
VCC
V+ + V-
C4 + 0.1 F 10V
+ C5 0.1 F
C3 0.1 F 6.3V
0.1 F + 10V
T1IN T2IN R1OUT R2OUT
T1
T1OUT
EIA/TIA-232 OUTPUTS
T2
T2OUT R1IN
EIA/TIA-232 INPUTS*
R1
CMOS OUTPUTS
R2
R2IN
DD
ADM1385
GND
SD
*INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT
REV. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 (c) Analog Devices, Inc., 2000
ADM3202/ADM3222/ADM1385-SPECIFICATIONS
(VCC = +3.3 V
Parameter DC CHARACTERISTICS Operating Voltage Range VCC Power Supply Current Shutdown Supply Current LOGIC Input Logic Threshold Low, VINL Input Logic Threshold High, VINH CMOS Output Voltage Low, VOL CMOS Output Voltage High, VOH Input Leakage Current Output Leakage Current RS-232 RECEIVER EIA-232 Input Voltage Range EIA-232 Input Threshold Low EIA-232 Input Threshold High EIA-232 Input Hysteresis EIA-232 Input Resistance RS-232 TRANSMITTER Output Voltage Swing (RS-232) Output Voltage Swing (RS-562) Transmitter Output Resistance RS-232 Output Short Circuit Current Output Leakage Current TIMING CHARACTERISTICS Maximum Data Rate Receiver Propagation Delay TPHL TPLH Transmitter Propagation Delay Receiver Output Enable Time Receiver Output Disable Time Transmitter Skew Receiver Skew Transition Region Slew Rate
0.3 V, C1-C4 = 0.1 F. All specifications TMIN to TMAX unless otherwise noted.)
Min 3.0 Typ 3.3 1.3 8 0.01 Max 5.5 2.1 10 0.5 0.8 2.0 0.4 VCC - 0.6 0.01 1 10 +30 1.2 1.6 0.4 5 5.2 2.4 7 Unit V mA mA A V V V V A A V V V V k V V mA A kbps 0.4 0.4 300 200 200 30 300 1 1 750 s s ns ns ns ns ns VCC = 3.3 V. All Transmitter Outputs Loaded with 3 k to Ground VCC = 3.0 V VCC = 0 V, VOUT = 2 V SD = Low, VOUT = 12 V VCC = 3.3 V, RL = 3 k to 7 k, CL = 50 pF to 1000 pF. One Tx Switching Test Conditions/Comments
No Load RL = 3 k to GND
TIN TIN IOUT = 1.6 mA IOUT = -1 mA TIN = GND to VCC* Receivers Disabled
-30 0.6
3 5.0 3.7 300
15
25
460
RL = 3 k, CL = 1000 pF
6 4
*ADM1385: Input leakage current typically -10 A when TIN = GND. Specifications subject to change without notice.
10 10
30 30
V/s V/s
Measured from +3 V to -3 V or -3 V to +3 V, VCC = +3.3 V RL = 3 k, CL = 1000 pF, TA = +25C RL = 3 k, CL = 2500 pF, TA = +25C
-2-
REV. A
ADM3202/ADM3222/ADM1385
ABSOLUTE MAXIMUM RATINGS*
(TA = +25C unless otherwise noted)
ORDERING GUIDE
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +6 V V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VCC - 0.3 V) to +14 V V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to -14 V Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to (V+, +0.3 V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V ROUT . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to (VCC + 0.3 V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Power Dissipation Power Dissipation N-16 . . . . . . . . . . . . . . . . . . . . . 450 mW (Derate 6 mW/C above +50C) JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . 117C/W Power Dissipation R-16 . . . . . . . . . . . . . . . . . . . . . 450 mW (Derate 6 mW/C above +50C) JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . 158C/W Power Dissipation RU-16 . . . . . . . . . . . . . . . . . . . 500 mW (Derate 6 mW/C above +50C) JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . 158C/W Power Dissipation R-18 . . . . . . . . . . . . . . . . . . . . . 450 mW (Derate 6 mW/C above +50C) JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . 158C/W Power Dissipation RS-20 . . . . . . . . . . . . . . . . . . . . 450 mW (Derate 6 mW/C above +50C) JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . 158C/W Power Dissipation RU-20 . . . . . . . . . . . . . . . . . . . 450 mW (Derate 6 mW/C above +50C) JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . 158C/W Operating Temperature Range Industrial (A Version) . . . . . . . . . . . . . . . . -40C to +85C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300C ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .<1500 V
*This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operation sections of this specificatio n is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.
Model ADM3202AN ADM3202ARN ADM3202ARW ADM3202ARU ADM3222AN ADM3222ARW ADM3222ARS ADM3222ARU ADM1385ARS
Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Package Options* N-16 R-16A R-16 RU-16 N-18 R-18 RS-20 RU-20 RS-20
*N = Plastic DIP; R = Small Outline; RS = Shrink Small Outline; RU = Thin Shrink Small Outline.
REV. A
-3-
ADM3202/ADM3222/ADM1385
PIN FUNCTION DESCRIPTIONS PIN CONNECTIONS DIP (N, R Packages)
EN 1
C1+ 1 V+ 2 C1- 3 C2+ 4
16 VCC 15 GND 14 T1OUT
Mnemonic VCC V+ V- GND C1+, C1-
Function Power Supply Input: +3.3 V 0.3 V. Internally Generated Positive Supply (+6 V Nominal). Internally Generated Negative Supply (-6 V Nominal). Ground Pin. Must be connected to 0 V. External Capacitor 1 is connected between these pins. 0.1 F capacitor is recommended but larger capacitors up to 47 F may be used. External Capacitor 2 is connected between these pins. 0.1 F capacitor is recommended but larger capacitors up to 47 F may be used. Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. Transmitter (Driver) Outputs. These are RS-232 signal levels (typically 9 V). Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 k pull-down resistor to GND is connected on each input. Receiver Outputs. These are CMOS output logic levels. (ADM3222) Receiver Enable, Active Low. When low, the receiver outputs are enabled. When high, they are three-stated. (ADM3222) Shutdown Control. Active Low. When low, the charge pump is shut down and the transmitter outputs are disabled. (ADM1385) Shutdown Control. When low, the charge pump is shut down and all transmitters and receivers are disabled. (ADM1385) Driver Disable. When low, the charge pump is turned off and the transmitters are disabled. The receivers remain active.
18 17 16
SD VCC GND T1OUT
C1+ 2 V+ 3 C1- 4 C2+ 5
ADM3202
13 R1IN
ADM3222
15
TOP VIEW C2- 5 (Not to Scale) 12 R1OUT V- 6 T2OUT 7 R2IN 8
11 T1IN 10 T2IN 9
TOP VIEW 14 R1IN (Not to Scale) C2- 6 13 R1OUT V- 7
12 11 10
T1IN T2IN R2OUT
T2OUT 8 R2IN 9
R2OUT
C2+, C2-
PIN CONNECTIONS DIP (RS, RU Packages)
EN 1 C1+ 2 V+ 3 C1- 4 C2+ 5 C2- 6
20 19 18
TxIN TxOUT RxIN
SD VCC GND T1OUT R1IN
DD 1 C1+ 2 V+ 3 C1- 4 C2+ 5 C2- 6
20 SD 19 VCC 18 GND
ADM3222 (SSOP TSSOP)
17 16
RxOUT EN
TOP VIEW 15 R1 OUT (Not to Scale) 14 NC V- 7
13 12 11
16 R1IN TOP VIEW 15 R1OUT (Not to Scale) 14 T1IN V- 7 13 T2IN 12 R2OUT 11 NC
ADM1385 (SSOP)
17 T1OUT
T2OUT 8 R2IN 9 R2OUT 10
T1IN T2IN NC
T2OUT 8 R2IN 9 NC 10
SD
NC = NO CONNECT
NC = NO CONNECT
SD
DD
-4-
REV. A
ADM3202/ADM3222/ADM1385 Typical Performance Characteristics
6 TOUT (HIGH) 4 4 2 2 0 0 -2 -2 -4 -4 TOUT (LOW) -6 -8 V- (V) 8 6 V+ (V)
-6
0
1000
2000 3000 LOAD CAPACITANCE - pF
4000
5000
0
10
20 CURRENT - mA
30
40
Figure 1. Transmitter Output Voltage High/Low vs. Load Capacitance @ 230 kbps
Figure 4. Charge Pump V+, V- vs. Current
12
250
10
200 V- IMPEDANCE
8 150 6 100 4 50 V+ IMPEDANCE
2
0
3
3.5
4.0
4.5 VCC - V
5.0
5.5
0 3.0
3.5
4.0 VCC - V
4.5
5.0
5.5
Figure 2. Transmitter Output Voltage High vs. VCC
Figure 5. Charge Pump Impedance vs. VCC
8 6 4 2 0 -2 -4 -6 -8 T1OUT (LOW) - V T1OUT (HIGH) - V
25 IDD (mA) @ 250kbps 20
15
IDD (mA) @ 160kbps
10
IDD (mA) @ 80kbps
5
0
2
4 6 CURRENT - mA
8
10
0
0
1000
2000 3000 4000 LOAD CAPACITANCE - pF
5000
Figure 3. Transmitter Output Voltage Low/High vs. Load Current
Figure 6. Power Supply Current vs. Load Capacitance
REV. A
-5-
ADM3202/ADM3222/ADM1385
+3.3V INPUT 0.1 F + 10V
T1IN 2V/DIV
C1+ C1-
+3.3V TO +6.6V VCC VOLTAGE V+ DOUBLER V-
C3 + 0.1 F 6.3V C4 + 0.1 F 10V T1OUT
+ C5 0.1 F
0.1 F + 10V
T1OUT 5V/DIV
C2+ +6.6V TO -6.6V VOLTAGE INVERTER C2-
T1IN CMOS INPUTS T2IN R1OUT R2OUT
T1
EIA/TIA-232 OUTPUTS T2 T2OUT R1IN EIA/TIA-232 INPUTS* R2 GND R2IN
1 s/DIV
Figure 7. 230 kbps Data Transmission
GENERAL DESCRIPTION
R1
CMOS OUTPUTS
The ADM3202/ADM3222/ADM1385 are RS-232 line drivers/ receivers. Step-up voltage converters coupled with level shifting transmitters and receivers allow RS-232 levels to be developed while operating from a single +3.3 V supply. CMOS technology is used to keep the power dissipation to an absolute minimum, allowing maximum battery life in portable applications. The ADM3202/ADM3222/ADM1385 is a modification, enhancement and improvement to the AD230-AD241 family and its derivatives. It is essentially plug-in compatible and does not have materially different applications.
CIRCUIT DESCRIPTION
0.1 F + 10V C1+ C1-
ADM3202
*INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT +3.3V INPUT
+3.3V TO +6.6V VCC VOLTAGE V+ DOUBLER V-
C3 + 0.1 F 6.3V C4 + 0.1 F 10V T1OUT T2OUT R1IN R2IN
+ C5 0.1 F
0.1 F + 10V
C2+ +6.6V TO -6.6V VOLTAGE INVERTER C2-
T1IN CMOS INPUTS T2IN R1OUT R2OUT EN
T1
T2
EIA/TIA-232 OUTPUTS
The internal circuitry consists of three main sections. These are: 1. A charge pump voltage converter 2. 3.3 V logic to EIA-232 transmitters 3. EIA-232 to 5 V logic receivers.
Charge Pump DC-DC Voltage Converter
CMOS OUTPUTS
R1
EIA/TIA-232 INPUTS*
R2
ADM3222
GND
SD
The charge pump voltage converter consists of a 200 kHz oscillator and a switching matrix. The converter generates a 6.6 V supply from the input +3.3 V level. This is done in two stages using a switched capacitor technique as illustrated below. First, the +3.3 V input supply is doubled to +6.6 V using capacitor C1 as the charge storage element. The +6.6 V level is then inverted to generate -6.6 V using C2 as the storage element. C3 is shown connected between V+ and VCC, but is equally effective if connected between V+ and GND. Capacitors C3 and C4 are used to reduce the output ripple. Their values are not critical and can be increased if desired. Capacitor C3 is shown connected between V+ and VCC. It is also acceptable to connect this capacitor between V+ and GND. If desired, larger capacitors (up to 10 F) can be used for capacitors C1-C4.
CMOS INPUTS
*INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT +3.3V INPUT 0.1 F + 10V C1+ C1- +3.3V TO +6.6V VCC VOLTAGE V+ DOUBLER V-
0.1 F + 10V
C2+ +6.6V TO -6.6V VOLTAGE INVERTER C2-
C3 0.1 F 6.3V C4 + 0.1 F 10V T1OUT T2OUT R1IN R2IN EIA/TIA-232 INPUTS* EIA/TIA-232 OUTPUTS
+
+ C5 0.1 F
T1IN T2IN R1OUT R2OUT DD
T1
T2
R1
CMOS OUTPUTS
R2
ADM1385
GND
SD
*INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT
Figure 8. Typical Operating Circuits
-6-
REV. A
ADM3202/ADM3222/ADM1385
S1 VCC C1 S2 GND INTERNAL OSCILLATOR + S4 VCC C3 + S3 V+ = 2VCC
Receiver Section
Figure 9. Charge Pump Voltage Doubler
S1 FROM VOLTAGE DOUBLER V+ C2 S2 + S4 V- = -(V+) C4 + S3 GND
The receivers are inverting level-shifters that accept RS-232 input levels and translate them into 3 V logic output levels. The inputs have internal 5 k pull-down resistors to ground and are also protected against overvoltages of up to 30 V. Unconnected inputs are pulled to 0 V by the internal 5 k pull-down resistor. This, therefore, results in a Logic 1 output level for unconnected inputs or for inputs connected to GND. The receivers have Schmitt trigger inputs with a hysteresis level of 0.4 V. This ensures error-free reception for both noisy inputs and for inputs with slow transition times.
HIGH BAUD RATE
GND INTERNAL OSCILLATOR
Figure 10. Charge Pump Voltage Inverter
Transmitter (Driver) Section
The drivers convert 3.3 V logic input levels into RS-232 output levels. With VCC = +3.3 V and driving an RS-232 load, the output voltage swing is typically 6 V.
The ADM3202E/ADM3222E feature high slew rates permitting data transmission at rates well in excess of the EIA/RS-232E specifications. RS-232 voltage levels are maintained at data rates up to 460 kbps even under worst case loading conditions. This allows for high speed data links between two terminals or indeed it is suitable for the new generation ISDN modem standards which requires data rates of 230 kbps. The slew rate is internally controlled to less than 30 V/s in order to minimize EMI interference.
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
16-Lead Plastic DIP (N-16)
0.840 (21.34) 0.745 (18.92)
16 1 9 8
16-Lead Narrow Body SOIC (R-16A)
0.3937 (10.00) 0.3859 (9.80)
0.280 (7.11) 0.240 (6.10) 0.060 (1.52) 0.015 (0.38) 0.130 (3.30) MIN
PIN 1 0.210 (5.33) MAX 0.160 (4.06) 0.115 (2.93) 0.022 (0.558) 0.014 (0.356) 0.100 (2.54) BSC
0.325 (8.26) 0.300 (7.62) 0.195 (4.95) 0.115 (2.93)
0.1574 (4.00) 0.1497 (3.80) 1
16
9 8
0.2440 (6.20) 0.2284 (5.80)
PIN 1 0.0098 (0.25) 0.0040 (0.10)
0.0688 (1.75) 0.0532 (1.35)
0.0196 (0.50) x 45 0.0099 (0.25)
0.070 (1.77) SEATING 0.045 (1.15) PLANE
0.015 (0.381) 0.008 (0.204)
0.0500 SEATING (1.27) PLANE BSC
0.0192 (0.49) 0.0138 (0.35)
8 0.0099 (0.25) 0 0.0075 (0.19)
0.0500 (1.27) 0.0160 (0.41)
16-Lead Thin Shrink Small Outline (TSSOP) (RU-16)
0.201 (5.10) 0.193 (4.90)
16 9
16-Lead Wide Body SOIC (R-16)
0.4133 (10.50) 0.3977 (10.00)
16 9
1
8
1
8
PIN 1 0.006 (0.15) 0.002 (0.05) 0.0433 (1.10) MAX 0.0118 (0.30) 0.0075 (0.19)
PIN 1 0.0118 (0.30) 0.0040 (0.10)
0.028 (0.70) 0.020 (0.50)
0.1043 (2.65) 0.0926 (2.35)
0.4193 (10.65) 0.3937 (10.00)
0.2992 (7.60) 0.2914 (7.40)
0.177 (4.50) 0.169 (4.30)
0.256 (6.50) 0.246 (6.25)
0.0291 (0.74) x 45 0.0098 (0.25)
0.0256 SEATING (0.65) PLANE BSC
8 0 0.0079 (0.20) 0.0035 (0.090)
0.0500 (1.27) BSC
0.0192 (0.49) SEATING 0.0138 (0.35) PLANE
0.0125 (0.32) 0.0091 (0.23)
8 0
0.0500 (1.27) 0.0157 (0.40)
REV. A
-7-
ADM3202/ADM3222/ADM1385
18-Lead Plastic DIP (N-18)
0.925 (23.49) 0.845 (21.47)
18 1 10 9
18-Lead Wide Body SOIC (R-18)
0.4625 (11.75) 0.4469 (11.35)
0.4193 (10.65) 0.3937 (10.00)
0.2992 (7.60) 0.2914 (7.40)
PIN 1 0.210 (5.33) MAX 0.160 (4.06) 0.115 (2.93) 0.022 (0.558) 0.100 0.014 (0.356) (2.54) BSC
0.060 (1.52) 0.015 (0.38) 0.130 (3.30) MIN 0.070 (1.77) SEATING PLANE 0.045 (1.15)
0.325 (8.25) 0.300 (7.62) 0.195 (4.95) 0.115 (2.93)
1 9
0.015 (0.381) 0.008 (0.204)
PIN 1
0.1043 (2.65) 0.0926 (2.35)
0.0291 (0.74) x 45 0.0098 (0.25)
0.0118 (0.30) 0.0040 (0.10)
8 0.0500 0.0192 (0.49) 0 (1.27) 0.0138 (0.35) SEATING 0.0125 (0.32) PLANE BSC 0.0091 (0.23)
0.0500 (1.27) 0.0157 (0.40)
20-Lead Thin Shrink Small Outline (TSSOP) (RU-20)
0.260 (6.60) 0.252 (6.40)
20 11
20-Lead Shrink Small Outline (SSOP) (RS-20)
0.295 (7.50) 0.271 (6.90)
20
11
0.177 (4.50) 0.169 (4.30)
0.256 (6.50) 0.246 (6.25)
1
0.311 (7.9) 0.301 (7.64)
10
1
10
0.006 (0.15) 0.002 (0.05)
PIN 1 0.0433 (1.10) MAX 0.0256 (0.65) 0.0118 (0.30) BSC 0.0075 (0.19)
0.078 (1.98) PIN 1 0.068 (1.73)
0.07 (1.78) 0.066 (1.67)
SEATING PLANE
8 0 0.0079 (0.20) 0.0035 (0.090)
0.028 (0.70) 0.020 (0.50)
0.008 (0.203) 0.002 (0.050) 0.0256 (0.65) BSC 8 SEATING 0.009 (0.229) 0 PLANE 0.005 (0.127) 0.037 (0.94) 0.022 (0.559)
0.212 (5.38) 0.205 (5.21)
-8-
REV. A
PRINTED IN U.S.A.
C00071-0-8/00 (rev. A)
0.280 (7.11) 0.240 (6.10)
18
10


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